| REBLIC ARMOR |
|---|
| High Performance FKM |
 |
| REBLIC ARMOR is a inorganic filler-free type high performance fluoroelastomer, specially developed for semiconductor manufacturing equipment. It has excellent properties for semiconductor manufacturing processes that involve plasma environments such as Dry Etch and CVD, aimed at reducing particle generation and adhesion to extend sealing lifetime. REBLIC ARMOR’s softness also helps improve the ease of installation. |
| - Plasma Etch / Remote Fluorine Plasma Clean
HDPCVD / PECVD / Metal CVD / LPCVD / ALD etc. - Static Locations (Chamber Lid / Gas Inlet / etc.) |
| Color | Reddish Brown |
|---|---|
| Hardness(Shore A) | 55 |
| Tensile Strength (MPa) | 17 |
| Elongation(%) | 300 |
| Modulus 100% Elongation (MPa) | 1.5 |
| Maximum Temperature (℃) | 200 |
| Minimum Temperature (℃) | -5 |
| Compression Set (%) | 20 |
| Cool Set (%) | 12 |
| URL | REBLIC ARMOR |